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  • Simon Bowker Heighes

SEMICONDUCTOR EQUIPMENT CORP INTRODUCES NEW MODELS

The New Model 865 multipurpose die bonder offers you the ability to perform eutectic, ultrasonic, epoxy, thermocompression and solder flip all in one compact system. It has evolved into the premier tool for R&D and low-volume production with a global install base. 

Benefits include:

High accuracy within 1 micron placement

New Dual camera vision system option for ultra high resolution

Custom systems for your specific application

Fast and easy set-up

Compact footprint

Intuitive Windows based operating system

Low maintenance with minimal calibrations

Economical price; only select options you need


SEC MODEL 850


SEC´s Model 850 is a versatile, semi-automatic placement system for flip chips, chip scale devices and bare die. The system is intended for low volume production and development projects requiring accuracies of +/- 12 microns. A typical application consists of a cycle in which devices are picked up from a waffle pack, dipped into flux and then placed on a substrate.


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