SEMICONDUCTOR EQUIPMENT CORP INTRODUCES NEW MODELS
The New Model 865 multipurpose die bonder offers you the ability to perform eutectic, ultrasonic, epoxy, thermocompression and solder flip all in one compact system. It has evolved into the premier tool for R&D and low-volume production with a global install base.
High accuracy within 1 micron placement
New Dual camera vision system option for ultra high resolution
Custom systems for your specific application
Fast and easy set-up
Intuitive Windows based operating system
Low maintenance with minimal calibrations
Economical price; only select options you need
SEC MODEL 850
SEC´s Model 850 is a versatile, semi-automatic placement system for flip chips, chip scale devices and bare die. The system is intended for low volume production and development projects requiring accuracies of +/- 12 microns. A typical application consists of a cycle in which devices are picked up from a waffle pack, dipped into flux and then placed on a substrate.
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